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| Flex
Interconnects used to connect rigid boards together allowing
folding and positioning to solve high-density packaging
problems. |
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Flex Circuits
with assembled connectors to speed your assembly.
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Flex
Circuits and surface mount components combined to achieve
high-density
packaging, including chip on-board.
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Solid
and patterned designs depending on noise and impedence
requirements.
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Used
to rigidize circuits in the component areas. Stiffener
frames to assist wave soldering, clips apart and folds
into position.
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| Conductor
traces and spaces are available in .002" on single
side flex and .003"-.004" on double sided
and multi-layer circuits. |
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Adhesive
placed in key locations to improve circuit
placement and mounting.
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| For
easy assembly and installation. |
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Pins
can be conductor extensions or solder pins. Consult
Northpoint sales for other available options.
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